Mathematical modeling of the thermal process shells of distributed electrical systems

Currently, the problem is the uncertainty of the physical processes of complex-structured electrical complexes, which requires a set of thermal experiments on simulation models, in order to determine the thermophysical parameters of individual parts and elements for analyzing the mutual influence of temperature fields in distributed electrical complexes. At the same time, taking into account the influence of external and internal influencing factors, the approach to solving the problems of such heat exchange is limited by the complexity of electromagnetic processes in elements with various physical properties, as well as the difficulties of taking into account the sets of structures of a complex configuration, which leads to the need for new more accurate solutions on the principles of mathematical modeling. In the presence of a reliable thermal mathematical model, it will be possible to develop a rational design using techniques and structures, taking into account the effective distribution of heat flows. In this regard, in the course of mathematical modeling, all available surfaces of the electrical complex were taken into account when forming the thermal mode technique. The analysis of thermal characteristics will allow predicting the behavior of such distributed electrical complexes at the design stages, which closely links the design methods that ensure resistance to destabilizing factors.

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