ПРОБЛЕМАТИКА КОНТРОЛЯ И УПРАВЛЕНИЯ ПАРАМЕТРАМИ МИКРОКЛИМАТА В МИКРОЭЛЕКТРОННОЙ ПРОМЫШЛЕННОСТИ
Работая с нашим сайтом, вы даете свое согласие на использование файлов cookie. Это необходимо для нормального функционирования сайта, показа целевой рекламы и анализа трафика. Статистика использования сайта отправляется в «Яндекс» и «Google»
Научный журнал Моделирование, оптимизация и информационные технологииThe scientific journal Modeling, Optimization and Information Technology
Online media
issn 2310-6018

THE PROBLEMS OF MONITORING AND CONTROL OF MICROCLIMATE PARAMETERS IN THE MICROELECTRONICS INDUSTRY

Gusev K.Y.,  Zhiltsov D.V.,  Burkovsky V.L.,  Gusev P.Y. 

UDC 681.2-5
DOI: 10.26102/2310-6018/2019.25.2.016

  • Abstract
  • List of references
  • About authors

Currently, more and more attention in the strategic planning of industrial development in Russia is paid to enterprises working in the field of microelectronics. This is confirmed by a large number of conferences, forums and meetings at the highest state level on the development of microelectronics in Russia. The main part of the enterprises producing microelectronic products began their work in the Soviet period. That is, today there are production shops, which in their size and characteristics do not coincide with modern production lines of microelectronic products. The article presents the influence of microclimate parameters on the quality of products. Both the characteristics of the air entering and leaving the premises and the electrostatic characteristics undoubtedly affecting the production of microelectronics and often leading to marriage, as well as the parameters of the water used in the production are considered. The result of the review of the current level of control in the microelectronic industry described above parameters is the formulation of problems – the lack of a systematic approach in the formulation of technical specifications, the development of all stages of the project and the construction or reconstruction of the microelectronic industry in the key management parameters of the microclimate shop, electrostatic parameters and characteristics of industrial water and gas.

1. Smelyakov A. L., Tikhonov A. F., Mugattarov A. M. Automatic control of excess pressure differential between adjacent areas // Mechanization of construction. – 2015. – no. 12. – pp 48-50.

2. Pobat S. V. automation of processes of engineering systems of heat supply and air conditioning of industrial enterprises: dis. – abstract of the thesis Moscow, 2010.

3. GOST 18725-83. Integrated circuits. General technical conditions (as Amended by N 1, 2, 3, 4).

4. White V. the Design of clean rooms. – Cleanroom, 2004.

5. Fesenko E. O. automation of industrial ventilation and air conditioning systems. Bulletin of modern research. – 2018. – no. 2.2. – pp 58-59.

6. Vostokov V. V., Vasyukov A. N. Technologies for creating "clean rooms" in the health care facilities of the Russian Federation // Medical alphabet. – 2012. – Vol. 3. – no. 16. – pp 43-52.

7. Gorlov M. I. Static electricity and semiconductor electronics // Nature. – 2006. – no. 12. – pp 27-36.

Gusev Konstantin Yurievich
Candidate of Technical Sciences
Email: gussev_konstantin@mail.ru

Voronezh State Technical University

Voronezh, Russian Federation

Zhiltsov Dmitry Viktorovich

Email: dv20@niiet.ru

Voronezh State Technical University

Voronezh, Russian Federation

Burkovsky Viktor Leonidovich
Doctor of Technical Sciences, Professor
Email: bvl@vorstu.ru

Voronezh State Technical University

Voronezh, Russian Federation

Gusev Pavel Yuryevich

Email: GusevPvl@gmail.com

Voronezh State Technical University

Voronezh, Russian Federation

Keywords: control, microelectronic industry, control of parameters, .

For citation: Gusev K.Y., Zhiltsov D.V., Burkovsky V.L., Gusev P.Y. THE PROBLEMS OF MONITORING AND CONTROL OF MICROCLIMATE PARAMETERS IN THE MICROELECTRONICS INDUSTRY. Modeling, Optimization and Information Technology. 2019;7(2). URL: https://moit.vivt.ru/wp-content/uploads/2019/05/Gusev2Soavtori_2_19_1.pdf DOI: 10.26102/2310-6018/2019.25.2.016 (In Russ).

591

Full text in PDF

Published 30.06.2019